Thermally Conductive Adhesive

Product Description

THERMALLY CONDUCTIVE ADHESIVE SE-1984 :-

Dow Corning one-part moisture cure adhesives are generally cured at room temperature and in an environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital.  Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product.  Faster manufacturing throughput can be achieved since the adhesive and component can be handled in much shorter times of about 10 to 120 minutes, depending on the adhesive selected and the amount applied.  These adhesives are not typically used in highly confined spaces or where a deep section cure is required as they generally cure from the exposed surface inward at a rate of 0.25 inch per seven days.  Cure progresses from the outer exposed surface and is dependent on the moisture in the air.  Working time is generally a few minutes to an hour for these products until a surface skin begins to form. Mild heat below 60C (140F) may be used to increase through-put by accelerating the cure. Dow Corning silicone adhesives retain their original physical and electrical properties over a broad range of operating conditions which enhance the reliability of and service life of electronic devices.  The stable chemistry and versatile processing options of these adhesives offer benefits for a variety of electronics needs from increasing component safety and reliability, reducing total cost or increasing the performance envelope of devices or modules.  Underwriters Laboratory (UL) 94 recognition is based on minimum thickness requirements.  Please consult the UL Online Certifications Directory for the most accurate certification information. 

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