RTV- 3145 :-
Dow Corning brand one-part moisture cure adhesives are generally cured at room temperature and in an environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product. Faster manufacturing throughput can be achieved since the adhesive and component can be handled in much shorter times of about 10 to 120 minutes, depending on the adhesive selected and the amount applied. These adhesives are not typically used in highly confined spaces or where a deep section cure is required as they generally cure from the exposed surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer exposed surface and is dependent on the moisture in the air. Working time is generally a few minutes to an hour for these products until a surface skin begins to form. Mild heat below 60 C (140 F) may be used to increase through-put by accelerating the cure. Dow Corning brand adhesives retain their original physical and electrical properties over a broad range of operating conditions which enhance the reliability of and service life of electronic devices.
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TYPICAL PROPERTIES
Specification Writers:
These values are not intended for use in preparing specifications. Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on this product.
Property Unit Result
One or Two-Part - One Color - Clear Extrusion Rate g/min 78.6 Flow Rate - Slump in 0.092 Specific Gravity (Cured) - 1.10 Tack-Free Time at 25 C minutes 63.8 NVC (Non Volatile Content) % 96.9 Tensile Strength psi 864 Elongation % 626 Tensile Modulus psi 138 Tear Strength (Die B) ppi 223 Durometer Shore A - 45.6 Unprimed Adhesion - Lap Shear to Aluminum psi MPa N/cm2 1900 13.1 131 Dielectric Strength volts/mil 485 Volume Resistivity ohm*cm 4.4 E+14 Dielectric Constant at 100 Hz - 2.83 Dielectric Constant at 100 kHz - 2.83 Dissipation Factor at 100 Hz - 0.0005 Dissipation Factor at 100 kHz - <0.0002 Mil Specification NA MIL-A-46146 Group II