CN-8605
Dow Corning one-part moisture cure adhesives are generally cured at room temperature and in an environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product. Faster manufacturing throughput is achieve however since the adhesive and component can be handled in much shorter times of about 10 to 120 minutes depending on the adhesive selected and the amount of applied. These adhesives are not typically used in highly confined spaces or where a deep section cure is required as they generally cure from the exposed surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer exposed surface and is dependent on the moisture in the air. Working time is generally a few minutes to an hour for these products until a surface skin begins to form. Mild heat below 60C (140F) may be used to increase through-put by accelerating the cure. Dow Corning silicone adhesives retain their original physical and electrical properties over a broad range of operating conditions which enhance the reliability of and service life of electronic devices. The stable chemistry and versatile processing options of these adhesives offer benefits for a variety of electronics needs from increasing component safety and reliability, reducing total cost or increasing the performance envelope of devices or modules.
FEATURES
BENEFITS
POTENTIAL USES
APPLICATION METHODS
One-part, white, semi-flowable room temperature curing silicone adhesive
TYPICAL PROPERTIES Specification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on this product. Property Unit Value Viscosity cP mPa-sec Pa-sec 53000 53000 53
Specific Gravity (Cured) - 1.59
Skin Over Time at 25 C minutes 8
Tensile Strength
psi MPa kg/cm2
320 2.2 22
Elongation % 120
Durometer Shore A - 50
Unprimed Adhesion - Lap Shear to Aluminum
psi MPa kg/cm2
250 1.7 17
Dielectric Strength
volts/mil kV/mm
600 24
Volume Resistivity ohm*cm 3.32 E+16
Dielectric Constant at 100 Hz - 4
Dielectric Constant at 100 kHz - 3.2
Dissipation Factor at 100 hz - <0.1
Dissipation Factor at 100 kHz - <0.1
Content of Low Molecular Siloxane (D4-D10)
ppm 300
UL Flammability Classification NA 94V-0
Shelf Life at 25 C months 6